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BSI BS EN 60068-2-69:2017+A1:2019

Environmental testing -- Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
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BSI BS EN 60068-2-69:2017+A1:2019

Environmental testing -- Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

PUBLISH DATE 2019
PAGES 60
BSI BS EN 60068-2-69:2017+A1:2019

This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes.

The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.

This document provides the measurement procedures for solder alloys both with and without lead (Pb).

SDO BSI: British Standards Institution
Document Number EN 60068-2-69
Publication Date Sept. 11, 2019
Language en - English
Page Count 60
Revision Level 1
Supercedes
Committee EPL/501
Publish Date Document Id Type View
July 10, 2017 BS EN 60068-2-69:2017 Revision
July 31, 2007 BS EN 60068-2-69:2007 Revision
Aug. 15, 1996 BS EN 60068-2-69:1996 Revision
Sept. 11, 2019 BS EN 60068-2-69:2017+A1:2019 Consolidated
May 9, 2018 BS EN 60068-2-69:2017 Consolidated