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BSI BS EN 60286-3:2013

Packaging of components for automatic handling -- Packaging of surface mount components on continuous tapes
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BSI BS EN 60286-3:2013

Packaging of components for automatic handling -- Packaging of surface mount components on continuous tapes

PUBLISH DATE 2013
PAGES 44
BSI BS EN 60286-3:2013

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.

This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

SDO BSI: British Standards Institution
Document Number EN 60286-3
Publication Date Nov. 30, 2013
Language en - English
Page Count
Revision Level
Supercedes
Committee W/-
Publish Date Document Id Type View
Aug. 31, 2013 BS EN 60286-3:2013 Revision
Oct. 31, 2007 BS EN 60286-3:2007 Revision
April 15, 1998 BS EN 60286-3:1998 Revision
Nov. 30, 2013 BS EN 60286-3:2013 Consolidated