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BSI BS EN 62047-8:2011

Semiconductor devices. Micro-electromechanical devices -- Strip bending test method for tensile property measurement of thin films
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BSI BS EN 62047-8:2011

Semiconductor devices. Micro-electromechanical devices -- Strip bending test method for tensile property measurement of thin films

PUBLISH DATE 2011
PAGES 22
BSI BS EN 62047-8:2011
IEC 62047-8:2011 specifies the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the conventional tensile test. This testing method is valid for test pieces with a thickness between 50 nm and several mum, and with an aspect ratio (ratio of length to thickness) of more than 300. The hanging strip (or bridge) between two fixed supports are widely adopted in MEMS or micro-machines. It is much easier to fabricate these strips than the conventional tensile test pieces. The test procedures are so simple to be readily automated. This international standard can be utilized as a quality control test for MEMS production since its testing throughput is very high compared to the conventional tensile test.
SDO BSI: British Standards Institution
Document Number EN 62047-8
Publication Date June 30, 2011
Language en - English
Page Count 22
Revision Level
Supercedes
Committee EPL/47
Publish Date Document Id Type View
June 30, 2011 BS EN 62047-8:2011 Revision