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BSI BS EN 62137-1-3:2009

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint -- Cyclic drop test
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BSI BS EN 62137-1-3:2009

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint -- Cyclic drop test

PUBLISH DATE 2009
PAGES 28
BSI BS EN 62137-1-3:2009
The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.
SDO BSI: British Standards Institution
Document Number EN 62137-1-3
Publication Date March 31, 2009
Language en - English
Page Count 28
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
March 31, 2009 BS EN 62137-1-3:2009 Revision