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BSI BS EN 62137-1-4:2009

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint -- Cyclic bending test
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BSI BS EN 62137-1-4:2009

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint -- Cyclic bending test

PUBLISH DATE 2009
PAGES 18
BSI BS EN 62137-1-4:2009
The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.
SDO BSI: British Standards Institution
Document Number EN 62137-1-4
Publication Date March 31, 2009
Language en - English
Page Count 18
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
March 31, 2009 BS EN 62137-1-4:2009 Revision