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BSI BS IEC 61189-5-4:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
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BSI BS IEC 61189-5-4:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

PUBLISH DATE 2015
PAGES 26
BSI BS IEC 61189-5-4:2015
structures and assemblies. General test methods for material
SDO BSI: British Standards Institution
Document Number BS IEC 61189
Publication Date Jan. 31, 2015
Language en - English
Page Count
Revision Level
Supercedes
Committee
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