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BSI BS IEC 62047-27:2017

Semiconductor devices. Micro-electromechanical devices -- Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
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BSI BS IEC 62047-27:2017

Semiconductor devices. Micro-electromechanical devices -- Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

PUBLISH DATE 2020
PAGES 20
BSI BS IEC 62047-27:2017
IEC 62047-27:2017(E) specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance for the design of deviating sample geometries.
The micro-chevron-test is an experimental method to determine the fracture toughness KIC of brittle materials or bond interfaces using specifically designed test chips (micro-chevron-samples) under defined load conditions (crack opening mode I). Owing to its high precision and low variance, it is suitable for analysing the influence of different process parameters on bond strength as well as for quality assurance.
SDO BSI: British Standards Institution
Document Number IEC 62047-27
Publication Date July 22, 2020
Language en - English
Page Count 20
Revision Level
Supercedes
Committee EPL/47
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