Logo
Login Sign Up
Current Revision

BSI BS IEC 62047-36:2019

Semiconductor devices. Micro-electromechanical devices -- Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
Best Price Guarantee
Instant

$222.36

2-5 Days

$222.36

SAVE 10%

$400.25


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
British Standards Institution Logo

BSI BS IEC 62047-36:2019

Semiconductor devices. Micro-electromechanical devices -- Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

PUBLISH DATE 2019
PAGES 18
BSI BS IEC 62047-36:2019

This part of IEC 62047 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under electrical stress, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of converse piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e., piezoelectric thin films used as actuators.

This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.

SDO BSI: British Standards Institution
Document Number IEC 62047-36
Publication Date April 24, 2019
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/47
Loading...

Failed to load document history.

Publish Date Document Id Type View