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BSI BS IEC 62047-37:2020

Semiconductor devices. Micro-electromechanical devices -- Environmental test methods of MEMS piezoelectric thin films for sensor application
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BSI BS IEC 62047-37:2020

Semiconductor devices. Micro-electromechanical devices -- Environmental test methods of MEMS piezoelectric thin films for sensor application

PUBLISH DATE 2023
PAGES 20
BSI BS IEC 62047-37:2020
IEC 62047-37:2020 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under mechanical stress and strain, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of direct piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e. piezoelectric thin films used as acoustic sensors, or as cantilever-type sensors.
This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.
SDO BSI: British Standards Institution
Document Number IEC 62047-37
Publication Date April 5, 2023
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/47
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