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BSI BS IEC 62047-38:2021

Semiconductor devices. Micro-electromechanical devices -- Test method for adhesion strength of metal powder paste in MEMS interconnection
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BSI BS IEC 62047-38:2021

Semiconductor devices. Micro-electromechanical devices -- Test method for adhesion strength of metal powder paste in MEMS interconnection

PUBLISH DATE 2021
PAGES 16
BSI BS IEC 62047-38:2021
Metal powder paste in MEMS interconnection
SDO BSI: British Standards Institution
Document Number IEC 62047-38
Publication Date July 7, 2021
Language en - English
Page Count 16
Revision Level
Supercedes
Committee EPL/47
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