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BSI BS IEC 62047-47:2024

Semiconductor devices. Micro-electromechanical devices -- Silicon based MEMS fabrication technology. Measurement method of bending strength of microstructures
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BSI BS IEC 62047-47:2024

Semiconductor devices. Micro-electromechanical devices -- Silicon based MEMS fabrication technology. Measurement method of bending strength of microstructures

PUBLISH DATE 2024
PAGES 20
BSI BS IEC 62047-47:2024

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SDO BSI: British Standards Institution
Document Number IEC 62047-47
Publication Date Aug. 28, 2024
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/47
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