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BSI BS EN IEC 62239-1:2018

Process management for avionics. Management plan -- Preparation and maintenance of an electronic components management plan
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BSI BS EN IEC 62239-1:2018

Process management for avionics. Management plan -- Preparation and maintenance of an electronic components management plan

PUBLISH DATE 2018
PAGES 80
BSI BS EN IEC 62239-1:2018

This part of IEC 62239 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished.

In general, the plan owner of a complete electronic components management plan (ECMP) is the avionics original equipment manufacturer (OEM).

NOTE

SAE EIA-STD-4899 can be used to comply with the requirements of IEC 62239‑1 where applicable (see Annex C), to enable the plan owner to harmonise its plan for both documents.

This document provides an aid in the aerospace certification process.

Although developed for the avionics industry, this process can be applied by other industrial sectors.

SDO BSI: British Standards Institution
Document Number IEC 62239-1
Publication Date Dec. 13, 2018
Language en - English
Page Count 80
Revision Level
Supercedes
Committee GEL/107
Publish Date Document Id Type View
Dec. 13, 2018 BS EN IEC 62239-1:2018 Revision