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BSI BS IEC 62899-503-3:2021

Printed electronics -- Quality assessment. Measuring method of contact resistance for the printed thin film transistor. Transfer length method
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BSI BS IEC 62899-503-3:2021

Printed electronics -- Quality assessment. Measuring method of contact resistance for the printed thin film transistor. Transfer length method

PUBLISH DATE 2021
PAGES 16
BSI BS IEC 62899-503-3:2021

This part of IEC 62899 specifies a measuring method of contact resistance for printed thin film transistors (TFTs) by the transfer length method (TLM). The method requires the fabrication of a test element group (TEG) with varying channel length (L) between source and drain electrodes. The method is intended for quality assessment of TFT electrode contacts and is suited for determining whether the contact resistance lies within a desired range.

SDO BSI: British Standards Institution
Document Number IEC 62899-503-3
Publication Date Sept. 8, 2021
Language en - English
Page Count 16
Revision Level
Supercedes
Committee AMT/9
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