Logo
Login Sign Up
Current Revision

BSI BS IEC 62951-5:2019

Semiconductor devices. Flexible and stretchable semiconductor devices -- Test method for thermal characteristics of flexible materials
Best Price Guarantee
Instant

$228.85

2-5 Days

$228.85

SAVE 10%

$411.93


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
British Standards Institution Logo

BSI BS IEC 62951-5:2019

Semiconductor devices. Flexible and stretchable semiconductor devices -- Test method for thermal characteristics of flexible materials

PUBLISH DATE 2019
PAGES 18
BSI BS IEC 62951-5:2019
IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible materials. This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching.
SDO BSI: British Standards Institution
Document Number IEC 62951-5
Publication Date March 5, 2019
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/47
Loading...

Failed to load document history.

Publish Date Document Id Type View