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BSI BS IEC 63011-2:2018

Integrated circuits. Three dimensional integrated circuits -- Alignment of stacked dies having fine pitch interconnect
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BSI BS IEC 63011-2:2018

Integrated circuits. Three dimensional integrated circuits -- Alignment of stacked dies having fine pitch interconnect

PUBLISH DATE 2019
PAGES 16
BSI BS IEC 63011-2:2018
IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.
SDO BSI: British Standards Institution
Document Number IEC 63011-2
Publication Date Jan. 24, 2019
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/47
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