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BSI BS EN ISO 9455-17:2024

Soft soldering fluxes. Test methods -- Surface insulation resistance comb test and electrochemical migration test of flux residues
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This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453). This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.
SDO BSI: British Standards Institution
Document Number ISO 9455-17
Publication Date Jan. 25, 2024
Language en - English
Page Count 30
Revision Level
Supercedes
Committee EPL/501
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