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BSI PD ES 59008-3:1999

Data requirements for semiconductor die -- Mechanical, material and connectivity requirements
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BSI PD ES 59008-3:1999

Data requirements for semiconductor die -- Mechanical, material and connectivity requirements

PUBLISH DATE 1999
PAGES 14
BSI PD ES 59008-3:1999
WITHDRAWN, 3/7/2006
Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in its use.
SDO BSI: British Standards Institution
Document Number ES 59008-3
Publication Date Dec. 15, 1999
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/47
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