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BSI PD IEC/TS 62878-2-1:2015

Device embedded substrate -- Guidelines. General description of technology
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BSI PD IEC/TS 62878-2-1:2015

Device embedded substrate -- Guidelines. General description of technology

PUBLISH DATE 2015
PAGES 34
BSI PD IEC/TS 62878-2-1:2015

This part of IEC 62878 describes the basics of device embedding substrate.

This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.

The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.

SDO BSI: British Standards Institution
Document Number IEC/TS 62878-2-1
Publication Date April 30, 2015
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/501
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