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DOD MIL-STD-202/215A

Method 215, Resistance to Solvents
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The purpose of this test is as follows: a. To verify that markings or color coding will not become illegible or discolored on the parts (including printed wiring boards) when subjected to solvents and processes normally used to clean solder flux, fingerprints, and other contaminants from printed-wiring and terminal-board assemblies, etc. b. To verify that component protective coating, encapsulation material and sleeve material resistance are not degraded to the point where electrical or mechanical integrity is disturbed when subjected to solvents and processes normally used to clean solder flux, fingerprints, and other contaminants from printed wiring and terminal board assemblies, etc.
SDO DOD: U.S. Department of Defense
Document Number
Publication Date Dec. 14, 2020
Language en - English
Page Count 10
Revision Level A
Supercedes
Committee
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