IEC 60191-1 Ed. 3.0 en:2018

Current Revision
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

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Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

PUBLISH DATE 2018

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

IEC 60191-1:2018(E) gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.

This edition includes the following significant technical changes with respect to the previous edition:

  • a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8;
  • b) a definition of the term "stand-off" has been added;
  • c) the methods for locating the datum have been extended to be suitable for SMD-packages;
  • d) the visual identification of terminal position one for automatic handling has been clarified;
  • e) the rules for the drawing of terminals have been clarified;
  • f) Table A.1 has been completed with symbols specifically for SMD-packages;
  • g) Annex B "Standardization philosophy" has been deleted;
  • h) a normative Annex with special rules for SMD-packages has been added;
  • i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.
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