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IEC 60191-5 Ed. 2.0 b:1997

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
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IEC 60191-5 Ed. 2.0 b:1997

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

PUBLISH DATE 1997
PAGES 81
IEC 60191-5 Ed. 2.0 b:1997
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date April 4, 1997
Language b - English & French
Page Count
Revision Level 2.0
Supercedes
Committee 47D
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