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IEC 60191-6-1 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
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IEC 60191-6-1 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

PUBLISH DATE 2001
PAGES 14
IEC 60191-6-1 Ed. 1.0 en:2001

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages.

Design guide for gull-wing lead terminals.

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date Oct. 1, 2001
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 47D
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