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IEC 60191-6-10 Ed. 1.0 b:2003

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
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IEC 60191-6-10 Ed. 1.0 b:2003

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

PUBLISH DATE 2003
PAGES 18
IEC 60191-6-10 Ed. 1.0 b:2003
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
IEC 60191-6-10:2003 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON).
SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date Nov. 1, 2003
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47D
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