IEC 60191-6-12 Ed. 2.0 b:2011

Current Revision
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

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Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

PUBLISH DATE 2011
PAGES 42

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages.

Design guidelines for fine-pitch land grid array (FLGA).

IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.

This edition includes the following significant changes with respect to the previous edition:

  • Scope is expanded so that this standard includes the square type FLGA. The title of this standard has been changed accordingly: "Rectangular type" has been deleted from the title;
  • Ball pitch of 0,3 mm has been added;
  • Datum is changed from the body datum to the ball datum;
  • Combination lists of D, E, MD, and ME have been revised.
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