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IEC 60191-6-19 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
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IEC 60191-6-19 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

PUBLISH DATE 2010
PAGES 30
IEC 60191-6-19 Ed. 1.0 b:2010
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date Feb. 1, 2010
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47D
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