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IEC 60191-6-2 Ed. 1.0 b:2001

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
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IEC 60191-6-2 Ed. 1.0 b:2001

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

PUBLISH DATE 2001
PAGES 16
IEC 60191-6-2 Ed. 1.0 b:2001

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages.

Design guide for 1.50 mm, 1.27 mm, and 1.00 mm pitch ball and column terminal packages.

IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date Dec. 1, 2001
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47D
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