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IEC 60191-6-21 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
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IEC 60191-6-21 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

PUBLISH DATE 2010
PAGES 32
IEC 60191-6-21 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages.

Measuring methods for package dimensions of small outline packages (SOP).

IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date Aug. 1, 2010
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47D
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