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IEC 60191-6-22 Ed. 1.0 b:2012

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
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IEC 60191-6-22 Ed. 1.0 b:2012

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

PUBLISH DATE 2012
PAGES 38
IEC 60191-6-22 Ed. 1.0 b:2012

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages.

Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date Dec. 11, 2012
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47D
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