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IEC 60191-6-3 Ed. 1.0 b:2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
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IEC 60191-6-3 Ed. 1.0 b:2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

PUBLISH DATE 2000
PAGES 24
IEC 60191-6-3 Ed. 1.0 b:2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages.

Measuring methods for package dimensions of quad flat packs (QFP).

IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.

SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date Sept. 1, 2000
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47D
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