IEC 60191-6-4 Ed. 1.0 b:2003

Current Revision
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Best Price Guarantee Jun 1, 2003 EN/FR 22 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00
View in Library
or
International Electrotechnical Commission Logo

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

PUBLISH DATE 2003
PAGES 22

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages.

Measuring methods for package dimensions of ball grid array (BGA).

IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Loading...

Failed to load document history.

Publish Date Document Id Type View