IEC 60191-6-6 Ed. 1.0 b:2001

Current Revision
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

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Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

PUBLISH DATE 2001
PAGES 18

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages.

Design guide for fine pitch land grid array (FLGA)

IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA).

This standard applies to FLGAs whose terminal pitch is less than, or equal to, 0.80 mm and whose package body outline is square.

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