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IEC 60191-6-6 Ed. 1.0 b:2001

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
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IEC 60191-6-6 Ed. 1.0 b:2001

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

PUBLISH DATE 2001
PAGES 18
IEC 60191-6-6 Ed. 1.0 b:2001

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages.

Design guide for fine pitch land grid array (FLGA)

IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA).

This standard applies to FLGAs whose terminal pitch is less than, or equal to, 0.80 mm and whose package body outline is square.

SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date March 1, 2001
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47D
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