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IEC 60352-8 Ed. 1.0 b:2011

Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance
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IEC 60352-8 Ed. 1.0 b:2011

Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance

PUBLISH DATE 2011
PAGES 46
IEC 60352-8 Ed. 1.0 b:2011
Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance
IEC 60352-8:2011 Is applicable to compression mount connections with metallic spring contacts for use in telecommunication equipments and in other electronic devices employing similar techniques. Information on materials and data from industrial experience are included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this part of IEC 60352 is to determine the suitability of compression mount connections under specified electrical, mechanical and atmospheric conditions and to provide a means of comparing test results when the tools used to make the connectors are of different designs or manufacture.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60352
Publication Date Feb. 1, 2011
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 48B
Publish Date Document Id Type View
Feb. 1, 2011 Revision
Feb. 1, 2011 IEC 60352-8 Ed. 1.0 b:2011 Revision