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IEC 60455-3-11 Ed. 1.0 b:1988

Specification for solventless polymerisable resinous compounds used for electrical insulation. Part 3: Specifications for individual materials. Sheet 11: Epoxy resin-based coating powders
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IEC 60455-3-11 Ed. 1.0 b:1988

Specification for solventless polymerisable resinous compounds used for electrical insulation. Part 3: Specifications for individual materials. Sheet 11: Epoxy resin-based coating powders

PUBLISH DATE 1988
IEC 60455-3-11 Ed. 1.0 b:1988
Specification for solventless polymerisable resinous compounds used for electrical insulation. Part 3: Specifications for individual materials. Sheet 11: Epoxy resin-based coating powders
Contains the general and special requirements for thermosetting epoxy resin-based coating powders.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60455
Publication Date Jan. 1, 1988
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 15
Publish Date Document Id Type View
June 5, 2024 Revision
Jan. 1, 1988 IEC 60455-3-11 Ed. 1.0 b:1988 Revision