IEC 60749-14 Ed. 1.0 b:2003

Current Revision
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

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Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

PUBLISH DATE 2003
PAGES 36

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly.

Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

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