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IEC 60749-16 Ed. 1.0 b:2003

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
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IEC 60749-16 Ed. 1.0 b:2003

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

PUBLISH DATE 2003
PAGES 22
IEC 60749-16 Ed. 1.0 b:2003
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
SDO IEC: International Electrotechnical Commission
Document Number IEC 60749
Publication Date Jan. 1, 2003
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47
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