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IEC 60749-19 Ed. 1.1 b:2010

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
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IEC 60749-19 Ed. 1.1 b:2010

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

PUBLISH DATE 2010
PAGES 18
IEC 60749-19 Ed. 1.1 b:2010
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60749
Publication Date Nov. 1, 2010
Language b - English & French
Page Count
Revision Level 1.1
Supercedes
Committee 47
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