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IEC 60749-21 Ed. 3.0 en:2025

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
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IEC 60749-21 Ed. 3.0 en:2025

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

IEC 60749-21 Ed. 3.0 en:2025
IEC 60749-21:2025 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for “dip and look” solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification.
NOTE 1 This test method does not assess the effect of thermal stresses which can occur during the soldering process. More details can be found in IEC 60749 15 or IEC 60749 20.
NOTE 2 If a qualitative test method is preferred, the Wetting balance test method can be found in IEC 60068-2-69.
This edition includes the following significant technical changes with respect to the previous edition:
- revision to certain operating conditions in line with current working practices.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60749
Publication Date Not Available
Language en - English
Page Count 24
Revision Level 3.0
Supercedes
Committee 47
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