IEC 60749-22 Ed. 1.0 b:2002

Current Revision
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

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Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

PUBLISH DATE 2002
PAGES 50

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determines compliance with specified bond strength requirements.

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