Logo
Login Sign Up
Current Revision

IEC 60749-22 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Best Price Guarantee
Instant

$200.00

2-5 Days

$200.00

SAVE 10%

$360.00

Modifications (Amendments, Corrigenda, Errata, etc.)

$0.00

$0.00

$0.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
International Electrotechnical Commission Logo

IEC 60749-22 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

PUBLISH DATE 2002
PAGES 50
IEC 60749-22 Ed. 1.0 b:2002
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements
SDO IEC: International Electrotechnical Commission
Document Number IEC 60749
Publication Date Sept. 1, 2002
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47
Loading...

Failed to load document history.

Publish Date Document Id Type View