IEC 60749-31 Ed. 1.0 b:2002

Current Revision
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

Best Price Guarantee Aug 1, 2002 EN/FR 18 Pages

Modifications (Amendments, Corrigenda, Errata, etc.)

Version PDF Print Bundle
Corrigendum 1 Stand-Alone
$0.00 $0.00 $0.00

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00
View in Library
or
International Electrotechnical Commission Logo

Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

PUBLISH DATE 2002
PAGES 18

Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

Applicable to semiconductor devices (discrete devices and integrated circuits), this test determines whether the device ignites due to internal heating caused by excessive overloads.

Loading...

Failed to load document history.

Publish Date Document Id Type View