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IEC 60749-32 Ed. 1.1 b:2010

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
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IEC 60749-32 Ed. 1.1 b:2010

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

PUBLISH DATE 2010
PAGES 14
IEC 60749-32 Ed. 1.1 b:2010
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC 60749-32:2002+A1:2010 is applicable to semiconductor devices (discrete devices and integrated circuits). The object of this test is to determine whether the device ignites due to external heating. The test uses a needle flame, simulating the effect of small flames which may result from fault conditions within equipment containing the device. This consolidated version consists of the first edition (2002) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60749
Publication Date Nov. 1, 2010
Language b - English & French
Page Count
Revision Level 1.1
Supercedes
Committee 47
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