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IEC 60749-35 Ed. 1.0 b:2006

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
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IEC 60749-35 Ed. 1.0 b:2006

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

PUBLISH DATE 2006
PAGES 52
IEC 60749-35 Ed. 1.0 b:2006
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components
Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60749
Publication Date July 1, 2006
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47
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