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IEC 60749-36 Ed. 1.0 b:2003

Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state

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IEC 60749-36 Ed. 1.0 b:2003

Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state

PUBLISH DATE 2003

PAGES 16

Document Information

Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state

Provides a test for determining the effects of constant acceleration on cavity-type semiconductor devices. It is an accelerated test designed to indicate types of structural and mechanical weaknesses not necessarily detected in shock and vibration test.


SDO	IEC: International Electrotechnical Commission
Document Number	IEC 60749
Publication Date	Feb. 1, 2003
Language	b - English & French
Page Count
Revision Level	1.0
Supercedes
Committee	47

Publish Date	Document Id	Type	View
Feb. 1, 2003	IEC 60749-36 Ed. 1.0 b:2003	Revision
Feb. 1, 2003		Revision

SDO	Document	Title
BSI	BSI BS EN 60749-4	Semiconductor devices. Mechanical and climatic test methods -- Damp heat, steady state, highly accelerated stress test (HAST)
IEC	IEC 60749-4	Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
IEC	IEC 60749-5	Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
BSI	BSI BS EN 60749-36	Semiconductor devices. Mechanical and climatic test methods -- Acceleration, steady state
IEC	IEC 60749-38	Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
BSI	BSI BS EN 60749-38	Semiconductor devices. Mechanical and climatic test methods -- Soft error test method for semiconductor devices with memory
IEC	IEC 60749-41	Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
IEC	IEC 60749-10	Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
IEC	IEC 60749-44	Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
BSI	BSI BS EN 60749-5	Semiconductor devices. Mechanical and climatic test methods -- Steady-state temperature humidity bias life test
BSI	BSI BS EN IEC 60749-5	Semiconductor devices. Mechanical and climatic test methods -- Steady-state temperature humidity bias life test
IEC	IEC 60749-28	Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
IEC	IEC 60749-37	Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
IEC	IEC 60749-40	Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
IEC	IEC 60749-34-1	Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
IEC	IEC 60749-33	Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
IEC	IEC 60749-24	Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
BSI	BSI BS EN IEC 60749-41	Semiconductor devices. Mechanical and climatic test methods -- Standard reliability testing methods of non-volatile memory devices
BSI	BSI BS EN IEC 60749-10	Semiconductor devices. Mechanical and climatic test methods -- Mechanical shock. device and subassembly
BSI	BSI BS EN 60749-44	Semiconductor devices. Mechanical and climatic test methods -- Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
IEC	IEC 60749-22-2	Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
IEC	IEC 60749-22-1	Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods
IEC	IEC 60749-29	Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
IEC	IEC 60749-30	Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
IEC	IEC 60749-26	Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)