Logo
Login Sign Up
Current Revision

IEC 60749-37 Ed. 2.0 b:2022

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Best Price Guarantee

$201.74

2-5 Days

$201.74

SAVE 10%

$363.13


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
International Electrotechnical Commission Logo

IEC 60749-37 Ed. 2.0 b:2022

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

PUBLISH DATE 2022
PAGES 43
IEC 60749-37 Ed. 2.0 b:2022

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

IEC 60749-37:2022 is available as IEC 60749-37:2022 RLV, which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.

The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.

This edition includes the following significant technical changes with respect to the previous edition:

  • correction of a previous technical error concerning test conditions;
  • updates to reflect improvements in technology.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60749
Publication Date Oct. 1, 2022
Language b - English & French
Page Count
Revision Level 2.0
Supercedes
Committee 47
Loading...

Failed to load document history.

Publish Date Document Id Type View