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IEC 60749-40 Ed. 1.0 b:2011

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

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IEC 60749-40 Ed. 1.0 b:2011

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

PUBLISH DATE 2011

PAGES 48

Document Information

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.


SDO	IEC: International Electrotechnical Commission
Document Number	IEC 60749
Publication Date	July 1, 2011
Language	b - English & French
Page Count	48
Revision Level	1.0
Supercedes
Committee	47

Publish Date	Document Id	Type	View
July 1, 2011		Revision
July 1, 2011	IEC 60749-40 Ed. 1.0 b:2011	Revision

SDO	Document	Title
IEC	IEC 60749-38	Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
BSI	BSI BS EN 60749-38	Semiconductor devices. Mechanical and climatic test methods -- Soft error test method for semiconductor devices with memory
BSI	BSI BS EN 60749-37	Semiconductor devices. Mechanical and climatic test methods -- Board level drop test method using an accelerometer
BSI	BSI BS EN 60749-40	Semiconductor devices. Mechanical and climatic test methods -- Board level drop test method using a strain gauge
IEC	IEC 60749-37	Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
BSI	BSI BS EN IEC 60749-37	Semiconductor devices. Mechanical and climatic test methods -- Board level drop test method using an accelerometer
IEC	IEC 60749-28	Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
IEC	IEC 60749-41	Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
IEC	IEC 60749-10	Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
IEC	IEC 60749-44	Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
IEC	IEC 60749-34-1	Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
BSI	BSI BS EN IEC 60749-28	Semiconductor devices. Mechanical and climatic test methods -- Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). device level
BSI	BSI BS EN 60749-28	Semiconductor devices. Mechanical and climatic test methods -- Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). Device level
BSI	BSI BS EN IEC 60749-41	Semiconductor devices. Mechanical and climatic test methods -- Standard reliability testing methods of non-volatile memory devices
BSI	BSI BS EN IEC 60749-10	Semiconductor devices. Mechanical and climatic test methods -- Mechanical shock. device and subassembly
BSI	BSI BS EN 60749-44	Semiconductor devices. Mechanical and climatic test methods -- Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
IEC	IEC 60749-22-1	Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods
IEC	IEC 60749-22-2	Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
IEC	IEC 60749-29	Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
IEC	IEC 60749-30	Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
IEC	IEC 60749-26	Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC	IEC 60749-27	Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
IEC	IEC 60749-32	Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)
IEC	IEC 60749-31	Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)
BSI	BSI BS EN IEC 60749-34-1	Semiconductor devices. Mechanical and climatic test methods -- Power cycling test for power semiconductor module