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IEC 60749-40 Ed. 1.0 b:2011

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
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IEC 60749-40 Ed. 1.0 b:2011

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

PUBLISH DATE 2011
PAGES 48
IEC 60749-40 Ed. 1.0 b:2011

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge.

IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.

The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test.

This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.

SDO IEC: International Electrotechnical Commission
Document Number IEC 60749
Publication Date July 1, 2011
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47
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