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IEC 60749-42 Ed. 1.0 b:2014

Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
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IEC 60749-42 Ed. 1.0 b:2014

Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage

PUBLISH DATE 2014
PAGES 20
IEC 60749-42 Ed. 1.0 b:2014
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
IEC 60749-42:2014 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60749
Publication Date Aug. 12, 2014
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47
Publish Date Document Id Type View
Aug. 12, 2014 IEC 60749-42 Ed. 1.0 b:2014 Revision
Aug. 12, 2014 Revision