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IEC 60749-8 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
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IEC 60749-8 Ed. 1.0 b:2002

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

PUBLISH DATE 2002
PAGES 40
IEC 60749-8 Ed. 1.0 b:2002
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60749
Publication Date Aug. 1, 2002
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47
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