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IEC 61188-5-2 Ed. 1.0 b:2003

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
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IEC 61188-5-2 Ed. 1.0 b:2003

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

PUBLISH DATE 2003
PAGES 112
IEC 61188-5-2 Ed. 1.0 b:2003

Printed boards and printed board assemblies - Design and use

Part 5-2: Attachment (land/joint) considerations - Discrete components

Provides information on **land pattern geometries** used for the surface attachment of discrete electronic components.

Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61188
Publication Date June 1, 2003
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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