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IEC 61188-5-2 Ed. 1.0 b:2003

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
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International Electrotechnical Commission Logo

IEC 61188-5-2 Ed. 1.0 b:2003

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

PUBLISH DATE 2026
PAGES 112
IEC 61188-5-2 Ed. 1.0 b:2003
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61188
Publication Date April 1, 2026
Language b - English & French
Page Count 112
Revision Level 1.0
Supercedes
Committee 91
Publish Date Document Id Type View
April 1, 2026 IEC 61188-5-2 Ed. 1.0 b:2003 Revision
June 1, 2003 Revision