IEC 61188-5-2 Ed. 1.0 b:2003

Current Revision
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

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Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

PUBLISH DATE 2003
PAGES 112

Printed boards and printed board assemblies - Design and use

Part 5-2: Attachment (land/joint) considerations - Discrete components

Provides information on **land pattern geometries** used for the surface attachment of discrete electronic components.

Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

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