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IEC 61188-5-4 Ed. 1.0 b:2007

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
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IEC 61188-5-4 Ed. 1.0 b:2007

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

PUBLISH DATE 2026
PAGES 20
IEC 61188-5-4 Ed. 1.0 b:2007
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61188
Publication Date April 1, 2026
Language b - English & French
Page Count 20
Revision Level 1.0
Supercedes
Committee 91
Publish Date Document Id Type View
April 1, 2026 IEC 61188-5-4 Ed. 1.0 b:2007 Revision
Oct. 1, 2007 Revision