Logo
Login Sign Up
Current Revision

IEC 61188-5-6 Ed. 1.0 b:2003

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
Best Price Guarantee
Instant

$145.53

2-5 Days

$145.53

SAVE 10%

$261.95


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
International Electrotechnical Commission Logo

IEC 61188-5-6 Ed. 1.0 b:2003

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

PUBLISH DATE 2003
PAGES 46
IEC 61188-5-6 Ed. 1.0 b:2003

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides.

Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides.

Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61188
Publication Date Jan. 1, 2003
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
Loading...

Failed to load document history.

Publish Date Document Id Type View