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IEC 61188-5-8 Ed. 1.0 b:2007

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
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IEC 61188-5-8 Ed. 1.0 b:2007

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

PUBLISH DATE 2007
PAGES 34
IEC 61188-5-8 Ed. 1.0 b:2007

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns, or protective coated lands.

The intent of the information presented herein is to provide the appropriate size, shape, and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing, and reworking of those solder joints.

This publication is to be read in conjunction with IEC 61188-5-1:2002.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61188
Publication Date Oct. 1, 2007
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 91
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